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Surface - mount package shrinks power MOSFETs by 20%
Toshiba America Electronic Components Inc. (TAEC) announced the availability of its second-generation Smart Thin Package (STP2) surface-mount packaging for power MOSFETs that is 20 percent smaller than the original STP package. Details... more...
16 - bit A/D converter achieves 81.2dB SNR at half the power
Linear Technology has introduced the LTC2217, a low noise, high performance 16-bit, 105Msps A/D converter with 81.2dBFS Signal-to-Noise Ratio (SNR) and 100dBc Spurious Free Dynamic Range (SFDR). Details... more...
Switching module improves efficiency, saves space
Toshiba introduces a 35-A synchronous step-down converter MCM for DC/DC converters used in high- and low-power mobile computers and servers. Details... more...