Service manuals, schematics, documentation, applications, datasheets, electronics

Surface - mount package shrinks power MOSFETs by 20%

Toshiba America Electronic Components Inc. (TAEC) announced the availability of its second-generation Smart Thin Package (STP2) surface-mount packaging for power MOSFETs that is 20 percent smaller than the original STP package.
Details

2008-02-20 21:40:00

Back / to news list