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AMD puts 450mm fab transition on hold
Adopting a different approach than rival Intel Corp., Advanced Micro Devices Inc. (AMD) is set on maximizing utilization of existing 300mm fabs before moving to the larger 450mm wafer size. Details... more...
Memory module pair tops JEDEC specs
Virtium Technology has come up with a DDR3 VLP and DDR3 ULP blade memory modules for embedded computing applications. Details... more...
Reference design enables low - cost Bluetooth mice
Broadcom and Avago Technologies have jointly announced a new low-cost reference design platform for building laser mice based on Bluetooth technology. Details... more...