Service manuals, schematics, documentation, applications, datasheets, electronics
HeJian partners with Beijing IC Design Park on 0.18µm service
HeJian Technology (Suzhou) Co. Ltd will team up with Beijing IC Design Park to unveil multi-project wafer service. Details... more...
Chipbond to set up facilities for 12inch wafers
Chipbond Technology Corp. announced plans of setting up solder bumping facilities to process 10,000 to 12,000 units of 12inch wafers monthly. Details... more...
IBM, Nortel raise devt of IMS infrastructure
IBM and Nortel Networks are expanding an existing joint development pact on IP multimedia subsystems to cover new software integration and new facilities to carry out joint interoperability testing. Details... more...