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Motorola-TI pact highlights 3G, WiMAX, OMAP
Motorola and Texas Instruments are expanding their partnership to include 3G, WiMAX and OMAP technologies in the design and development of experience-optimized mobile devices. Details... more...
Sematech, TEL advance work on 3D interconnects
Sematech and Tokyo Electron entered into a multi-year joint development program to improve the use of 3D interconnect technology and high mobility channel materials in advanced manufacturing. Details... more...
Semiconductor spending to hit 8% growth
Semiconductor spending by OEMs will grow 8.6 percent this year, with the rise driven by a slew of consumer electronics products. Details... more...