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TI reveals details of 45 - nm process
Texas Instruments described how
5b4
it lowered power by 63 percent and increased performance by 55 percent for its DSPs at the 45-nanometer node at the International Solid-State Circuits Conference (ISSCC). Details... more...
Wireless front end remains an integration challenge
A panel at the International Solid Sate Circuits Conference examined potential solutions for integrating wireless interfaces onto a chip. Details... more...
Turning bits of aircraft into furniture
Some of this stuff is very cool - I really love the "get bombed" table, which is made out of a real bomb! Details... more...