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Image sensor packaging slims down for CE, cars
Solid-state image sensors must be packaged to protect against corrosion, mechanical damage and obscuration by dust particles. Current wafer-level packages provide a low-cost, chip-size solution with a total thickness of less than 500<M>m that will also pass stringent automotive reliability standards. Details... more...
Use time - domain methods to measure crosstalk
This article discusses the elements of crosstalk, and demonstrates how you can measure crosstalk on a single-layer PCB using an oscilloscope or a signal analyzer. Details... more...
Testing HSUPA devices
HSUPA is an exciting new technology that will enable much higher data rates in the uplink than current systems. However, HSUPA places high demands on the wireless device?s transmitter, processor, internal buses and memory allocation. The device?s performance must be tested while HSUPA channels are active. Details... more...