Service manuals, schematics, documentation, applications, datasheets, electronics
|
|
|
Image sensor packaging slims down for CE, cars
|
|
Image sensor packaging slims down for CE, cars |
Solid-state image sensors must be packaged to protect against corrosion, mechanical damage and obscuration by dust particles. Current wafer-level packages provide a low-cost, chip-size solution with a total thickness of less than 500<M>m that will also pass stringent automotive reliability standards.
Details
2007-11-16 00:00:00
|
|
| |
|
|
|