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DisplayLink raises $24 million in C round
DisplayLink Inc., the de
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veloper of semiconductors and software for network display applications, has raised $24 million a Series C round, bringing to $51 million the total venture capital funding raised since the company was founded in 2003. Details... more...
Infineon brings Wafer Level Packaging to new level
Infineon has developed a package technology that significantly broadens the application spectrum of Wafer Level Ball Grid Array (WLB) packaging. The company has already licensed the technology to Taiwan-based packaging technology provider Advanced Semiconductor Engineering (ASE). Details... more...
Intel sells network chip to startup
The network processo
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r sector shifts to small and medium-sized providers with the announcement Intel Corp. is selling the high-end of its IXP business to startup Netronome Systems Inc. Details... more...