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Infineon brings Wafer Level Packaging to new level
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Infineon brings Wafer Level Packaging to new level |
Infineon has developed a package technology that significantly broadens the application spectrum of Wafer Level Ball Grid Array (WLB) packaging. The company has already licensed the technology to Taiwan-based packaging technology provider Advanced Semiconductor Engineering (ASE). Details
2007-11-12 15:36:00
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