ret2002_07.djvu Journals Remont_elektronnoj_texniki 2002 - Service manuals, schematics, documentation, applications, datasheets, electronics
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Copper substrates target high-current, power module apps
IRC Advanced Film Division announced that its TFC Series of cost-effective, solderable thick film copper substrate is being specified for high-current and power module applications. Details... more...
Speaker amp LSI suits portable apps
Oki Electric Industry Co. Ltd has released samples the ML2620 speaker amplifier LSI designed for in small and thin portable devices. Details... more...
AMD unveils code-reducing tech for x86
AMD has introduced the SSE5 code-reducing technology planned for its next-generation microprocessor expected in 2009. Details... more...