rc2008_07.djvu Journals Remont_and_service 2008 - Service manuals, schematics, documentation, applications, datasheets, electronics
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Ralink partners with AMD in Better by Design program
802.11a/b/g/n chipset developer Ralink Technology Corp. is the newest recruit of the Better by Design program, an AMD-driven initiative. Details... more...
Seashells inspire ultrathin yet ultrastrong materials
A University of Michigan engineering professor has succeeded in creating an ultrathin material as strong as steel by embedding nanomaterial in an organic polymer matrix, mimicking the way oysters embed calcium carbonate into an organic matrix to create seashells. Details... more...
FCoE chips rolling from Emulex, Nuova team - up
Emulex and Nuova Systems have struck a non-exclusive deal to co-develop chips for the emerging FCoE standard. Details... more...