rc2007_12.djvu Journals Remont_and_service 2007 - Service manuals, schematics, documentation, applications, datasheets, electronics
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Humble solder paste enables exotic heat-transfer devices
EFD has introduced the nondrip SAC305 solder paste for gap filling and application on vertical surfaces in heat-transfer applications. Details... more...
Nanotech aims at embedded computing
The Institute for Sustainable Nanoelectronics announced that seed funding of $2.6 million from Nanyang Technological University will initiate a joint effort between NTU and Rice University aimed at lowering the cost and power consumption of embedded microchips by means of nanoscale solutions. Details... more...
Solar firm gains $52 million in funding
SolFocus Inc., a developer of concentrator photovoltaic systems, anno
5b4
unced the closing of $52 million in funding. Details... more...