rm2008_03.djvu Journals Radiomir 2008 - Service manuals, schematics, documentation, applications, datasheets, electronics
| » Home / Journals / Radiomir / 2008 |
Front-end ICs fit Wi-Fi, Bluetooth systems
Anadigics Inc. has released a family of three front-end ICs (FEICs) in low profile standard packages targeting next-generation, Wi-Fi smart phones and consumer electronics products. Details... more...
NXP wins Samsung mobile phone design-in, says report
Dutch chip com
5b4
pany NXP BV is set to begin supplying South Korean consumer giant Samsung Electronics Co. Ltd. with an integrated circuit for inclusion in low-cost mobile phones in the fourth quarter, according to a Reuters article that referenced Frans van Houten, CEO of NXP, as its source. Details... more...
Applied showcases large-area solar module production line
With a new integrated production line for large-area solar panels, Applied Materials claims it can reduce the costs of photovoltaic system installations by more than 20 percent. The SolarFab Thin Film Line production system is presented at the European Photovoltaic Solar Conference presently held in Milan, Italy. Details... more...