rl2005_03.djvu Journals Radiolubitel 2005 - Service manuals, schematics, documentation, applications, datasheets, electronics
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IBM, Google gear students for Internet - scale apps
Google, IBM and several universities are joining forces to prepare for the challenges of Internet-scale applications. Details... more...
NXP picks CEVA DSP core for ULCH solutions
NXP has selected the CEVA-Teak DSP core for its highly integrated ultralow-cost single-chip solutions targeting low-cost and entry-level handset designs for emerging markets. Details... more...
Thermal pillar copper tech helps cool flip - chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat. Details... more...