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NXP claims piezoresistive silicon MEMS at 1.1 GHz
At IEDM, NXP res
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earchers reported on what they claimed to be a demonstrable scalable piezoresistive MEMS resonator built in silicon and operating at a record 1.1 GHz. Details... more...
Micron rolls DDR2 at 68 - nm
Micron Technology Inc. has begun sampling its new 1-Gbit DDR2 device, based on a 68-nm DRAM process technology. Details... more...
Dow Corning gains SiC contract
Dow Corning Compound Semiconductor S
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olutions (DCCSS) has been awarded a $4.2 million contract from the U.S. Office of Naval Research to develop semiconductor silicon carbide (SiC) materials technology. Details... more...