hd6473042f.pdf Integrated circuits - Service manuals, schematics, documentation, applications, datasheets, electronics

STATS ChipPAC Ltd. said that Sco 5b4 tt Jewler, executive vice president and chief strategy officer, has decided to leave the chip-packaging provider 'to pursue other interests.' Details... more...

NXP Semiconductors will invest 42 million euros in its Sound Solutions manufacturing and research activities in Vienna, Austria. The investment will help the company expand automated mass production of its unique rectangular speaker generation for mobile phones and develop more innovative products. Details... more...

Mouser stocks TI’s CC2431 true System-on-Chip that is ideal for systems where ultra-low power consumption is required. This wireless sensor networking Zigbee®/IEEE 802.15.4 solution includes a location detection hardware module used in blind nodes to receive signals from nodes with known locations. Details... more...