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Voices: Summit Micro's Pat Brocket
Pat Brocket is president and chief executive officer of Summit Micro. Before joining Summit, Brockett was president and chief executive officer of Zarlink Semiconductor. Previously, he spent 20 years at National Semiconductor in various management roles. Details... more...
RF emissions and FCC Part 15: EMI woes and cures
My first exposure to EMI (electromagnetic-interference) measurement was in trying to make my multiport, unshielded-twisted-pair Ethernet-hub card comply with FCC Part 15 Class A in a multicard chassis that leaked RF like a sieve. Details... more...
Hot, cold, and broken: Thermal - design techniques
Variations in temperature can make a circuit act unpredictably or even cause catastrophic failure. Here are some tips on what to look out for in your designs' reactions to temperature extremes. Details... more...