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Infineon - Intel team eyes high - density SIM cards
Infineon Technologies and Intel are working together for the development of optimized chip solutions for high-density SIM cards. Details... more...
WSTS: 2007 global chips sales better than expected
WSTS organization has increased its forecast for the increase in global sales of semiconductors for 2007. Details... more...
Qualcomm makes first call on 45nm 3G phone chip
Qualcomm has made the first phone call on a 3G chip manufactured with 45nm process technology from TSMC. Details... more...
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