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Sony transfers fabs to Toshiba
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ATCA proponents look to open up software features
Proponents of the Advanced Telecommunications Computing Architecture platform are pressing for new initiatives to woo more large telecom OEMs to open standards. Details... more...
Big EDA firms not prepared to drive 3D integration, says panel
European research organization IMEC is putting a renewed emphasis on chip packaging, and on 3D-integration in particular, according to plans emerging at a press briefing ahead of its Annual Research Review Meeting. However, IMEC and European chip company experts are not expecting much help to come from the "big three" EDA companies. Details... more...
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