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TSMC aims $60M for packaging
TSMC has approved capital appropriations totaling $59.8 million for use in establishing 300-mm, wafer-level packaging technology. Details... more...
Report: Tests show 802.11n outperforming 802.11g
Wireless LAN systems based on draft-compliant IEEE 802.11n chipsets from four vendors are significantly outperforming 802.11g-based systems. Details... more...
Practical design considerations--Ethernet vs. RapidIO standards
The RapidIO specification outlines an appropriate set of baseline functionality for chassis- and board-level applications resulting in lower implementation costs and reduced overall complexity. Details... more...