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Toshiba develops cost - competitive MEMS
Toshiba Corp. has announced two optimized packaging technologies for MEMS semiconductor packages that achieve significant cost reductions. Details... more...
Aeroflex gets LTE - ready
From Aeroflex comes the TM500 LTE test mobile designed to address the challenges of 3GPP LTE (3G Long Term Evolution) network infrastructure development test and rollout. Details... more...
LSI integrates embedded FRAM, EMI protection
Fujitsu Microelectronics Ltd has expanded its product line of spread-spectrum clock generators with the MB88R157 that provides countermeasures against EMI on high-frequency clock signals. Details... more...