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IBM - led group may double spending on packaging
The IBM-led Common P
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latform alliance plans to step up its investment in semiconductor packaging technology to pave the way to 32nm devices, potentially doubling its current level of spending in the area. Details... more...
Gamers help supercomputing project break world record
About 200,000
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PCs and gaming consoles helped give the Folding@home distributed network about one-quarter of a petaflop worth of computing power. Details... more...
Tensilica rolls major upgrade to Diamond processor family
The second-generation Diamond Standard processors feature additional multipliers and dividers, up to 30 percent lower memory power, and bridges for AXI-based AMBA systems. Details... more...