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NXP picks CEVA DSP core for ULCH solutions
NXP has selected the CEVA-Teak DSP core for its highly integrated ultralow-cost single-chip solutions targeting low-cost and entry-level handset designs for emerging markets. Details... more...
Thermal pillar copper tech helps cool flip - chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat. Details... more...
AT&T secures 700MHz licenses for $2.5B
Ensuring its leverage on the January auction of the 700MHz licenses, AT&T announced Tuesday that it will pick up a wide swath of the spectrum from Aloha Partners for $2.5 billion. Details... more...