|Electronisc World Hot News|
Silicon foundations simplify assembly lines
Two consecutive press briefings at January’s Consumer Electronics Show dealt with different products for different markets but delivered a similar message: that by migrating from a traditional approach comprising numerous discrete components to an integrated one based on silicon building blocks, you can not only potentially improve your end-system specifications, but also dramatically simplify, boost the yield, and reduce the cost of your system-manufacturing flow. Details... more...
RF emissions and FCC Part 15: EMI woes and cures
My first exposure to EMI (electromagnetic-interference) measurement was in trying to make my multiport, unshielded-twisted-pair Ethernet-hub card comply with FCC Part 15 Class A in a multicard chassis that leaked RF like a sieve. Details... more...
Voices: Summit Micro's Pat Brocket
Pat Brocket is president and chief executive officer of Summit Micro. Before joining Summit, Brockett was president and chief executive officer of Zarlink Semiconductor. Previously, he spent 20 years at National Semiconductor in various management roles. Details... more...
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