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IBM has announced a new semiconductor wafer reclamation process that uses a specialized pattern removal technique to repurpose scrap semiconductor wafers to a form used to manufacture silicon-based solar panels. Details... more...

Thin-film and printed batteries with their customizable shapes, flexible form factors and ultralow weight are enabling new functionality to be added to a broad range of electronic products, such as smartcards, RFID and sensors both increasing their usefulness and the size of their addressable markets. Details... more...

Texas Instruments Inc. has invited three universities in China—Tsinghua University, Shanghai Jiaotong University, and University of Electronic Science and Technology—to join its Worldwide Leadership University program. Details... more...