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Intel devising new interconnect scheme
Intel Corp. is expected to
5b4
introduce major changes in its microprocessor lines, by rolling out a new interconnect architecture that replaces its current front-side bus technology. Details... more...
Kemet debuts MLCC with enhanced flex mitigation
Kemet expands its X7R multilayer ceramic capacitor flex mitigation portfolio with the introduction of the FF-CAP that uses two existing Kemet technologies. Details... more...