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Big EDA firms not prepared to drive 3D integration, says panel
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Big EDA firms not prepared to drive 3D integration, says panel |
European research organization IMEC is putting a renewed emphasis on chip packaging, and on 3D-integration in particular, according to plans emerging at a press briefing ahead of its Annual Research Review Meeting. However, IMEC and European chip company experts are not expecting much help to come from the "big three" EDA companies.
Details
2007-10-18 12:57:00
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