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California Micro Devices Collaborates with SPEL Semiconductor to Add Two Leadless Molded Package Lines; Joint Investment Expected to Total $7.75 Million
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California Micro Devices Collaborates with SPEL Semiconductor to Add Two Leadless Molded Package Lines; Joint Investment Expected to Total $7.75 Million |
New Lines Expected to Become Qualified and Operational During Next Two Quarters MILPITAS, Calif., Jan.
Details
2007-01-25 18:30:16
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