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Multilayer chip baluns aimed at WiMAX apps
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Multilayer chip baluns aimed at WiMAX apps |
FDK has developed four multilayer chip baluns for WiMAX and Mobile WiMAX applications that measure 1.6x0.8x0.6 mm with low insertion loss of 0.6-dB and match impedance between equilibrium and non-equilibrium circuits in RF devices designed in WiMAX communications equipment such as mobile phones, PDAs and car navigation systems.
Details
2007-03-15 21:21:00
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