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Accurate Thermal Analysis of Chip/Package Systems
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Accurate Thermal Analysis of Chip/Package Systems |
With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming critical for insuring system reliability. Low power design methodologies create their own thermal challenges, as they may generate "hot" and "cool" regions on the chip. Causes and soutions are explored.
Details
2007-03-15 12:39:00
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