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06 Mar 2007 - Freescale Redistributed Chip Packaging technology moves toward volume production
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06 Mar 2007 - Freescale Redistributed Chip Packaging technology moves toward volume production |
AUSTIN, Texas - March 6, 2007 - Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing. In addition, the RCP technology hit a key milestone as it passed commercial industry specifications.
Details
2007-03-06 17:49:04
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