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Ericsson to show the latest in broadband and multimedia at 3GSM 2007
Ericsson strengthens its leading position, showcasing the most innovative technologies at 3GSM World Congress 2007 in Barcelona. Details... more...
Ericsson drives mobile broadband mass market with launch of HSPA embedded module
At 3GSM World Congress in Barcelona, February 12-15, Ericsson (NASDAQ:ERIC) is launching its new HSPA embedded module, which enables built-in mobile broadband in every new notebook computer, as well as in any other device. Details... more...
Silicon wafer market grew in 2006
Worldwide silicon wafer area shipments increased by 20 percent in 2006 when compared to 2005 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry. Details... more...