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Infineon brings Wafer Level Packaging to new level
Infineon has developed a package technology that significantly broadens the application spectrum of Wafer Level Ball Grid Array (WLB) packaging. The company has already licensed the technology to Taiwan-based packaging technology provider Advanced Semiconductor Engineering (ASE). Details... more...
Intel sells network chip to startup
The network processo
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r sector shifts to small and medium-sized providers with the announcement Intel Corp. is selling the high-end of its IXP business to startup Netronome Systems Inc. Details... more...
Cisco VC fund to target Central, Eastern Europe
Communications equipment vendor Cisco has linked with 3TS Capital Partners for a venture capital initiative targeting Central and Eastern Europe. Details... more...